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High-precision interferometer for inspecting the end face quality of optical fibers and optimizing the cutting process.
Clad diameter: 125 – 1200 µm, fiber coating: 250 – 1500 µm, models compatible with 3D image generation are also available. *For more details, please contact us.*
Analog connector end face inspection device from previous years.
■PC/APC compatible ■Built-in rechargeable battery with ≧6 hours of operation ■Handheld type ■2.5-inch TFT display
◆Built-in wireless module. Wireless inspection device that does not require network connection◆ Wireless connection is possible even in remote mountains or deep underground.
◆Compliant with IEC61300-3-35, with pass/fail judgment function◆Compatible with Android/iOS 【Specifications】 Model: HUXScope--WiFi Magnification: 260X-400X Field of View: 400um×300um Focus: Manual WiFi: 2.4GHz WiFi IEEE 802.11b/g/n Charging: AC or USB Battery: 3.7V rechargeable Li-ion battery Battery Life: 4 hours (continuous use) Interface: USB2.0, Bluetooth Software: For PC, for smartphone Dimensions: 185(H)×45(W)×24(D)mm Weight: 170g
◆Just insert it! The inspection pass/fail judgment for MPO-12 is completed in under 10 seconds◆ Compatible with single-core (LC, SC, ST) and multi-core (MPO) connectors.
◆Connector chip replacement is completed in just a few seconds. - Capable of MPO pin-to-pin imaging in accordance with IEC 61300-3-35 Ed. 3. - Large and easy-to-read screen with a convenient report creation feature. - Data storage for each job is possible with the dedicated app eXchange. The FIP-500 is the latest optical connector end-face inspection device designed based on EXFO's 35 years of experience and user requests. It can automatically complete inspections in just 10 seconds by simply inserting single-core (SC, LC) or multi-core (MPO) connectors, significantly improving the efficiency of connector inspection tasks. The gun-type housing features a pass/fail indicator lamp at the operator's hand, allowing for the transition to the next inspection without checking the display. The traditionally cumbersome replacement of the tip chip can now be done most efficiently, providing high performance even in operations at heights.
